Latent fingerprint enhancement on conductive substrates using electrodeposition of copper
Crossref DOI link: https://doi.org/10.1007/s11426-015-5347-4
Published Online: 2015-03-19
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Meiqin
Yu, Xi
Qin, Gang
Zhu, Yu
Wang, Meiling
Wei, Qianhui
Zhang, Yang
Zhang, Xueji
Text and Data Mining valid from 2015-03-19