Sequence assembly using next generation sequencing data—challenges and solutions
Crossref DOI link: https://doi.org/10.1007/s11427-014-4752-9
Published Online: 2014-10-17
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chin, Francis Y. L.
Leung, Henry C. M.
Yiu, S. M.
License valid from 2014-10-17