Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via (TSV) application
Crossref DOI link: https://doi.org/10.1007/s11431-014-5551-z
Published Online: 2014-08-07
Published Print: 2014-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ding, YingTao
Yan, YangYang
Chen, QianWen
Wang, ShiWei
Chen, Xiu
Chen, YueYang
Text and Data Mining valid from 2014-08-01