A preliminary experimental validation of superposition strategy in thermal management of integrated circuit with multiple hot-spots
Crossref DOI link: https://doi.org/10.1007/s11431-014-5645-7
Published Online: 2014-09-04
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Kun
Pi, YuDan
Wang, Wei
Li, ZhiHong
Chen, Jing
Jin, YuFeng
Text and Data Mining valid from 2014-09-04