Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted coefficients
Crossref DOI link: https://doi.org/10.1007/s11431-015-5896-y
Published Online: 2015-07-24
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lu, XiangNing
Shi, TieLin
Wang, SuYa
Li, LiYi
Su, Lei
Liao, GuangLan
Text and Data Mining valid from 2015-07-24