Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm
Crossref DOI link: https://doi.org/10.1007/s11431-017-9185-6
Published Online: 2018-02-01
Published Print: 2018-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lu, XiangNing
Liu, Fan
He, ZhenZhi
Li, LiYi
Hu, NingNing
Su, Lei
Text and Data Mining valid from 2018-02-01
Article History
Received: 1 November 2017
Accepted: 18 December 2017
First Online: 1 February 2018