Automated X-ray recognition of solder bump defects based on ensemble-ELM
Crossref DOI link: https://doi.org/10.1007/s11431-018-9324-3
Published Online: 2019-04-02
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Su, Lei
Wang, LingYu
Li, Ke
Wu, JingJing
Liao, GuangLan
Shi, TieLin
Lin, TingYu
Text and Data Mining valid from 2019-04-02
Article History
Received: 7 May 2018
Accepted: 23 July 2018
First Online: 2 April 2019