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TXV Technology: The cornerstone of 3D system-in-packaging

Crossref DOI link: https://doi.org/10.1007/s11431-022-2119-3

Published Online: 2022-08-10

Published Print: 2022-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Zhao, HeRan

Chen, MingXiang

Peng, Yang

Wang, Qing

Kang, Min

Cao, LiHua
License Information

Text and Data Mining valid from 2022-08-10

Version of Record valid from 2022-08-10
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Article History

Received: 11 April 2022

Accepted: 16 June 2022

First Online: 10 August 2022