Three-dimensional numerical manifold method for heat conduction problems with a simplex integral on the boundary
Crossref DOI link: https://doi.org/10.1007/s11431-022-2321-9
Published Online: 2023-11-01
Published Print: 2024-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tong, DeFu
Yi, XiongWei
Tan, Fei
Jiao, YuYong
Liang, JiaWei
Text and Data Mining valid from 2023-11-01
Version of Record valid from 2023-11-01
Article History
Received: 29 October 2022
Accepted: 17 January 2023
First Online: 1 November 2023