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Silicon-based MEMS hybrid packaging approach for terahertz front-end integration: architecture, design, and prototype validation

Crossref DOI link: https://doi.org/10.1007/s11432-025-4882-5

Published Online: 2026-04-20

Published Print: 2026-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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