A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack
Crossref DOI link: https://doi.org/10.1007/s11433-017-9138-x
Published Online: 2018-03-12
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yi, Dake
Wang, TzuChiang
Text and Data Mining valid from 2018-03-12
Article History
Received: 14 August 2017
Accepted: 21 November 2017
First Online: 12 March 2018