Document is current

Any future updates will be listed below

A new material removal rate model for high-shear and low-pressure grinding of single-crystal silicon considering elastohydrodynamic pressure

Crossref DOI link: https://doi.org/10.1007/s11465-025-0839-1

Published Online: 2025-06-20

Published Print: 2025-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark