Electrodeposition of Cu2+ in presence of Ni2+ in sulfuric acid system
Crossref DOI link: https://doi.org/10.1007/s11581-019-03037-x
Published Online: 2019-05-22
Published Print: 2019-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Yu
Li, Lei
Li, Hongjuan
Wang, Hua
Text and Data Mining valid from 2019-05-22
Version of Record valid from 2019-05-22
Article History
Received: 22 February 2019
Revised: 20 April 2019
Accepted: 25 April 2019
First Online: 22 May 2019