Microstructure and thermal properties of SiCp/Cu composites with Mo coating on SiC particles
Crossref DOI link: https://doi.org/10.1007/s11595-017-1704-9
Published Online: 2017-10-07
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Meng
Bai, Shuxin
Li, Shun
Zhao, Xun
Xiong, Degan
License valid from 2017-10-01