Effects of Electroless Plating with Cu Content on Thermoelectric and Mechanical Properties of p-type Bi0.5Sb1.5Te3 Bulk Alloys
Crossref DOI link: https://doi.org/10.1007/s11595-018-1896-7
Published Online: 2018-07-12
Published Print: 2018-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Dai, Xueting
Huang, Zhongyue
Yu, Yuan
Zhou, Chongjian
Zu, Fangqiu
Text and Data Mining valid from 2018-07-12
Article History
Received: 26 June 2017
Accepted: 10 September 2017
First Online: 12 July 2018