Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging
Crossref DOI link: https://doi.org/10.1007/s11595-019-2031-0
Published Online: 2019-02-18
Published Print: 2019-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Xu, Tao
Hu, Xiaowu
Li, Yulong
Jiang, Xiongxin
Yu, Xiao
Text and Data Mining valid from 2019-02-01
Article History
Received: 18 November 2017
Accepted: 25 November 2018
First Online: 18 February 2019