Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior
Crossref DOI link: https://doi.org/10.1007/s11595-019-2102-2
Published Online: 2019-06-10
Published Print: 2019-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lai, Yanqing
Hu, Xiaowu
Li, Yulong
Jiang, Xiongxin
Text and Data Mining valid from 2019-06-01
Version of Record valid from 2019-06-01
Article History
Received: 18 June 2018
Accepted: 25 January 2019
First Online: 10 June 2019