Microstructure and Dielectric Property of 3D BNf/Si3N4 Fabricated by CVI Process
Crossref DOI link: https://doi.org/10.1007/s11595-019-2123-x
Published Online: 2019-09-02
Published Print: 2019-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Jianping
Cheng, Laifei
Ye, Fang
Liu, Yongsheng
Yin, Xiaowei
Zhang, Mingxia
Text and Data Mining valid from 2019-08-01
Version of Record valid from 2019-08-01
Article History
Received: 10 May 2018
Accepted: 22 July 2018
First Online: 2 September 2019