Diffusion Bonding of Al 6061 and Cu by Hot Isostatic Pressing
Crossref DOI link: https://doi.org/10.1007/s11595-020-2242-4
Published Online: 2020-04-10
Published Print: 2020-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Teng, Qing
Li, Xiu
Wei, Qingsong
Text and Data Mining valid from 2020-02-01
Version of Record valid from 2020-02-01
Article History
Received: 29 May 2019
Accepted: 2 November 2019
First Online: 10 April 2020