Numerical Study on the Thermal Stress and its Formation Mechanism of a Thermoelectric Device
Crossref DOI link: https://doi.org/10.1007/s11630-018-1006-3
Published Online: 2018-05-18
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Pan, Tao
Gong, Tingrui
Yang, Wei
Wu, Yongjia
Text and Data Mining valid from 2018-05-18
Article History
Received: 15 January 2018
First Online: 18 May 2018