Numerical Simulation Study on Cooling Characteristics of a New Type of Film Hole
Crossref DOI link: https://doi.org/10.1007/s11630-020-1288-0
Published Online: 2020-07-25
Published Print: 2021-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Guo, Chunhai
Wang, Bin
Kang, Zhenya
Zhang, Wenwu
Zheng, Huilong
Text and Data Mining valid from 2020-07-25
Version of Record valid from 2020-07-25
Article History
Received: 20 May 2019
First Online: 25 July 2020