A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler
Crossref DOI link: https://doi.org/10.1007/s11630-022-1637-2
Published Online: 2022-07-20
Published Print: 2022-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Yongjia
Chen, Sen
Gong, Tingrui
Shi, Tianhao
Zuo, Lei
Yan, Yonggao
Fang, Yueping
Ming, Tingzhen
Text and Data Mining valid from 2022-07-01
Version of Record valid from 2022-07-01
Article History
Received: 8 April 2021
First Online: 20 July 2022