Microstructure Evolution During Al, Ti, and Mo Surface Deposition and Volume Diffusion in Ni-20Cr Wires and Woven Structures
Crossref DOI link: https://doi.org/10.1007/s11661-015-2794-7
Published Online: 2015-02-18
Published Print: 2015-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Cong
Dunand, David C.
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First Online: 18 February 2015