Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures
Crossref DOI link: https://doi.org/10.1007/s11661-015-2865-9
Published Online: 2015-03-31
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Luu, Thi-Thuy
Hoivik, Nils
Wang, Kaiying
Aasmundtveit, Knut E.
Vardøy, Astrid-Sofie B.
Text and Data Mining valid from 2015-03-31
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Article History
First Online: 31 March 2015