Preparation of NiO Monolayer by Langmuir–Blodgett Technique and Its Characterization as Diffusion Barrier for Copper Metallization
Crossref DOI link: https://doi.org/10.1007/s11661-015-2914-4
Published Online: 2015-04-28
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sharma, Sumit
Kumar, Mukesh
Rani, Sumita
Kumar, Dinesh
Tripathi, C. C.
Text and Data Mining valid from 2015-04-28
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Article History
First Online: 28 April 2015