High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds
Crossref DOI link: https://doi.org/10.1007/s11661-015-3068-0
Published Online: 2015-07-28
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Luu, Thi-Thuy
Hoivik, Nils
Wang, Kaiying
Aasmundtveit, Knut E.
Vardøy, Astrid-Sofie B.
Text and Data Mining valid from 2015-07-28
Version of Record valid from 2015-07-28
Article History
First Online: 28 July 2015