Passivation Behavior of Ultrafine-Grained Pure Copper Fabricated by Accumulative Roll Bonding (ARB) Process
Crossref DOI link: https://doi.org/10.1007/s11661-015-3239-z
Published Online: 2015-11-11
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Fattah-alhosseini, Arash
Imantalab, Omid
Text and Data Mining valid from 2015-11-11
Version of Record valid from 2015-11-11
Article History
First Online: 11 November 2015