Strengthening Mechanisms and Electrochemical Behavior of Ultrafine-Grained Commercial Pure Copper Fabricated by Accumulative Roll Bonding
Crossref DOI link: https://doi.org/10.1007/s11661-016-3519-2
Published Online: 2016-04-22
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Imantalab, O.
Fattah-Alhosseini, A.
Mazaheri, Y.
Keshavarz, M. K.
Text and Data Mining valid from 2016-04-22
Version of Record valid from 2016-04-22
Article History
First Online: 22 April 2016