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Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer

Crossref DOI link: https://doi.org/10.1007/s11661-016-3641-1

Published Online: 2016-07-12

Published Print: 2016-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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