Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows
Crossref DOI link: https://doi.org/10.1007/s11661-016-3739-5
Published Online: 2016-10-06
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Reeve, Kathlene N.
Choquette, Stephanie M.
Anderson, Iver E.
Handwerker, Carol A.
Text and Data Mining valid from 2016-10-06
Version of Record valid from 2016-10-06
Article History
Received: 17 March 2016
First Online: 6 October 2016