Transient-Liquid-Phase Bonding of H230 Ni-Based Alloy Using Ni-P Interlayer: Microstructure and Mechanical Properties
Crossref DOI link: https://doi.org/10.1007/s11661-017-4127-5
Published Online: 2017-05-11
Published Print: 2017-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kapoor, Monica
Doğan, Ömer N.
Carney, Casey S.
Saranam, Rajesh V.
McNeff, Patrick
Paul, Brian K.
Text and Data Mining valid from 2017-05-11
Version of Record valid from 2017-05-11
Article History
Received: 9 February 2017
First Online: 11 May 2017