Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder
Crossref DOI link: https://doi.org/10.1007/s11661-017-4178-7
Published Online: 2017-06-26
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jung, Do-Hyun
Sharma, Ashutosh
Lim, Dong-Uk
Yun, Jong-Hyun
Jung, Jae-Pil
Text and Data Mining valid from 2017-06-26
Version of Record valid from 2017-06-26
Article History
Received: 16 November 2016
First Online: 26 June 2017