Development of a Process Signature for Manufacturing Processes with Thermal Loads
Crossref DOI link: https://doi.org/10.1007/s11661-018-4719-8
Published Online: 2018-06-06
Published Print: 2018-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Frerichs, Friedhelm
Meyer, Heiner
Strunk, Rebecca
Kolkwitz, Benjamin
Epp, Jeremy
Text and Data Mining valid from 2018-06-06
Version of Record valid from 2018-06-06
Article History
Received: 14 November 2017
First Online: 6 June 2018