Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11661-018-4983-7
Published Online: 2018-10-26
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Zhe
Hu, Xiaowu
Jiang, Xiongxin
Li, Yulong
Text and Data Mining valid from 2018-10-26
Version of Record valid from 2018-10-26
Article History
Received: 15 January 2018
First Online: 26 October 2018