Fast Isothermal Solidification During Transient Liquid Phase Bonding of a Nickel Alloy Using Pure Copper Filler Metal: Solubility vs Diffusivity
Crossref DOI link: https://doi.org/10.1007/s11661-019-05149-5
Published Online: 2019-03-01
Published Print: 2019-05-15
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Ghasemi, Ali
Pouranvari, Majid
Text and Data Mining valid from 2019-03-01
Version of Record valid from 2019-03-01
Article History
Received: 11 October 2018
First Online: 1 March 2019