Microstructure Engineering to Optimize Hardness and Conductivity in Electrolytic Tough Pitch Copper
Crossref DOI link: https://doi.org/10.1007/s11661-019-05315-9
Published Online: 2019-06-11
Published Print: 2019-08-15
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Harshavardhana, N.
Gururajan, M. P.
Pant, Prita
Text and Data Mining valid from 2019-06-11
Version of Record valid from 2019-06-11
Article History
Received: 24 July 2018
First Online: 11 June 2019