Application of Diffusion Path Analysis to Understand the Mechanisms of Transient Liquid-Phase Bonding in the Ni-Si-B System
Crossref DOI link: https://doi.org/10.1007/s11661-019-05459-8
Published Online: 2019-09-24
Published Print: 2019-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Moreau, E. D.
Corbin, S. F.
Text and Data Mining valid from 2019-09-24
Version of Record valid from 2019-09-24
Article History
Received: 12 April 2019
First Online: 24 September 2019