Development of a Numerical Model for Simulating Transient Liquid Phase (TLP) Bonding Involving Two Solid–Liquid Interfaces that Concurrently Undergo 2D or 3D Migration
Crossref DOI link: https://doi.org/10.1007/s11661-021-06221-9
Published Online: 2021-03-22
Published Print: 2021-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Afolabi, Oluwadara C.
Ojo, Olanrewaju A.
Text and Data Mining valid from 2021-03-22
Version of Record valid from 2021-03-22
Article History
Received: 12 December 2020
Accepted: 22 February 2021
First Online: 22 March 2021