Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
Crossref DOI link: https://doi.org/10.1007/s11661-021-06499-9
Published Online: 2021-10-29
Published Print: 2022-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Chun-Hao
Lee, Pei-Ing
Yeh, Wei-Ting
Chuang, Tung-Han
Text and Data Mining valid from 2021-10-29
Version of Record valid from 2021-10-29
Article History
Received: 17 May 2021
Accepted: 10 October 2021
First Online: 29 October 2021