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Morphological Stability Limits of Ag–Cu–Al Nanocrystalline Thin Films Prepared via Reactive Sputtering in Ar–O2 Mixed Gas

Crossref DOI link: https://doi.org/10.1007/s11661-024-07462-0

Published Online: 2024-06-18

Published Print: 2024-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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