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Development of an Ag-Free Sn–Ti–Ni Solder for Low-Temperature Ultrasonic-Assisted Flux-Free Joining of Aluminium Alloys in Air

Published Online: 2026-09-01

Authors

Hardwick, Liam

Kumar, Mirtunjay

Xiao, Yong

Goodall, Russell
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Text and Data Mining valid from 2026-09-01

Version of Record valid from 2026-09-01
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Article History

Received: 5 May 2026

Accepted: 7 August 2026

First Online: 1 September 2026

Ethics

Conflict of interest: The authors declare that they have no conflicts of interest.

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