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Deposition and Characterization of 3-Aminopropyltrimethoxysilane Monolayer Diffusion Barrier for Copper Metallization

Crossref DOI link: https://doi.org/10.1007/s11663-014-0239-0

Published Online: 2014-12-24

Published Print: 2015-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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