Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards
Crossref DOI link: https://doi.org/10.1007/s11663-018-1243-6
Published Online: 2018-03-23
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kavousi, Maryam
Sattari, Anahita
Alamdari, Eskandar Keshavarz
Fatmehsari, Davoud Haghshenas
Text and Data Mining valid from 2018-03-23
Version of Record valid from 2018-03-23
Article History
Received: 2 June 2016
First Online: 23 March 2018