Effect of Current-Carrying Mold Current on Multi-physics Fields and Interface Bonding Quality of Compound Rolls
Crossref DOI link: https://doi.org/10.1007/s11663-021-02262-y
Published Online: 2021-07-14
Published Print: 2021-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hou, Zhiwen
Dong, Yanwu
Jiang, Zhouhua
Liu, Limeng
Du, Shuyang
Hu, Zhihao
Text and Data Mining valid from 2021-07-14
Version of Record valid from 2021-07-14
Article History
Received: 1 December 2020
Accepted: 10 June 2021
First Online: 14 July 2021