The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests
Crossref DOI link: https://doi.org/10.1007/s11664-014-3176-4
Published Online: 2014-05-08
Published Print: 2014-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Darbandi, Payam
Bieler, Thomas R.
Pourboghrat, Farhang
Lee, Tae-kyu
Text and Data Mining valid from 2014-05-08