Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry
Crossref DOI link: https://doi.org/10.1007/s11664-014-3303-2
Published Online: 2014-07-22
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jiang, Ting
Lei, Hong
Text and Data Mining valid from 2014-07-22