Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps
Crossref DOI link: https://doi.org/10.1007/s11664-014-3318-8
Published Online: 2014-08-07
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lin, Jui-Ching
Qin, Yi
Woertink, Julia
Text and Data Mining valid from 2014-08-07