Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films
Crossref DOI link: https://doi.org/10.1007/s11664-014-3319-7
Published Online: 2014-08-08
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Choi, Yongwon
Shin, Jiwon
Suk, Kyung-lim
Kim, Young Soon
Kim, Il
Paik, Kyung-Wook
Text and Data Mining valid from 2014-08-08