Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits
Crossref DOI link: https://doi.org/10.1007/s11664-014-3360-6
Published Online: 2014-09-05
Published Print: 2014-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shih, W. L.
Yang, T. L.
Chuang, H. Y.
Kuo, M. S.
Kao, C. R.
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