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Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Crossref DOI link: https://doi.org/10.1007/s11664-014-3377-x

Published Online: 2014-09-06

Published Print: 2014-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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